Difference between revisions of "Silicon Wafer (P-type) SiO2"
Jump to navigation
Jump to search
Line 1: | Line 1: | ||
==Description== | ==Description== | ||
− | The ''' | + | The '''Silicon Wafer (P-type) SiO<sub>2</sub>''' can be made from a [[Silicon Wafer (P-type)|Silicon Wafer (P-type)]] using the [[O2 Furnace|O<sub>2</sub> furnace]]. |
− | P type silicon is created when group III elements | + | P type silicon is created when group III elements such as boron, indium or gallium are used as the doping agent. The addition of these elements causes the silicon to have an abundance of positive charge carriers known as “holes”. The “P” stands for “positive” [https://waferpro.com/what-are-p-type-and-n-type-silicon-wafers/]. |
− | The SiO<sub>2</sub> layer, also called dieletric layer, is | + | The SiO<sub>2</sub> layer, also called dieletric layer, is an electrical insulator, functioning as a barrier for electrons [https://en.wikipedia.org/wiki/Dielectric]. |
Revision as of 03:43, 19 April 2024
Description
The Silicon Wafer (P-type) SiO2 can be made from a Silicon Wafer (P-type) using the O2 furnace.
P type silicon is created when group III elements such as boron, indium or gallium are used as the doping agent. The addition of these elements causes the silicon to have an abundance of positive charge carriers known as “holes”. The “P” stands for “positive” [1].
The SiO2 layer, also called dieletric layer, is an electrical insulator, functioning as a barrier for electrons [2].
Properties
Name | Value |
---|---|
Release Version | 1.3.2 |
Recipes
O2 Furnace
Outputs | Components | Recipe |
---|---|---|