Controller Chip
Description
The idea behind the microcontroller unit is its role as a cost-effective and energy-efficient processor designed for specific applications. Over the past few years, some of these devices have significantly increased in capability, leading to a blurring of the traditional definition of a microcontroller. Nowadays, controller chips are integrated into various devices such as Metal Detectors, Wearables, SSDs and CPUs.
Recipes
The starting point for the controller chip is a n-type Silicon Wafer with a SiO2 layer.
- Step 1.0 Get the Mask (Ctrl 1st well) from the Mask Writer.
Mask Writer
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- Step 1.1 Apply a Vial (Positive Photoresist) to the Silicon Wafer (N-type) SiO2 in the Chemical Solution Deposition machine and obtain the Silicon Wafer Ctrl 1.1.
Chemical Solution Deposition
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- Step 1.2 Use the Silicon Wafer Ctrl 1.1, Mask (Ctrl 1st well) and a UV bulb in the Contact Printer to imprint the pattern and obtain the Silicon Wafer Ctrl 1.2. For positive photoresist, the contact printer light will harden and unexposed positive photoresist is soft and easily removable. The opposite occurs in negative photoresist.
Contact Printer
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- Step 1.3 Use the Silicon Wafer Ctrl 1.2 and Vial (Positive Photoresist Developer) in the Chemical Processor to remove the unexposed photoresist and obtain Silicon Wafer Ctrl 1.3.
Chemical Processor
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- Step 1.4 Use the Silicon Wafer Ctrl 1.3 and Vial (Ammonium Fluoride Etchant) in the Chemical Processor to etch the 1st wells and obtain Silicon Wafer Ctrl 1.4.
Chemical Processor
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- Step 1.5 Use the Silicon Wafer Ctrl 1.4 and Vial (Photoresist Stripper SPM) in the Chemical Processor to remove the exposed photoresist and obtain Silicon Wafer Ctrl 1.5.
Chemical Processor
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- Step 1.6 Use the Silicon Wafer Ctrl 1.5 in the Wafer Washer to clean the wafer of photoresist residues and obtain Silicon Wafer Ctrl 1.6.
Wafer Washer
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- Step 1.7 Use the Silicon Wafer Ctrl 1.6, a bag of boron and Mask (Ctrl 1st well) in the Ion Beam to seed the 1st well with ions and obtain Silicon Wafer Ctrl 1.7.
Ion Implanter
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- Step 1.8 Use the Silicon Wafer Ctrl 1.7 and an Oxygen Cartridge in the O2 furnace to grow a SiO2 layer in the wafer and obtain Silicon Wafer Ctrl 1.8.
O2 Furnace
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- Step 1.9 Use the Silicon Wafer Ctrl 1.8 in the scanning electron microscope to check if the 1st well was correctly created and obtain Silicon Wafer Ctrl 1.9.
Scanning Electron Microscope
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- Step 2.0 Get the Mask (Ctrl 2nd well) from the Mask Writer.
Mask Writer
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- Step 2.1 Use the Silicon Wafer Ctrl 1.8 and a Vial (Positive Photoresist) in the Chemical Solution Deposition machine to obtain the Silicon Wafer Ctrl 2.1.
Chemical Solution Deposition
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- Step 2.2 Use the Silicon Wafer Ctrl 2.1, Mask (Ctrl 2nd well) and a UV bulb in the Contact Printer to imprint the etching pattern and obtain the Silicon Wafer Ctrl 2.3. For positive photoresist, the contact printer light will harden and unexposed positive photoresist is soft and easily removable. The opposite occurs in negative photoresist.
Contact Printer
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- Step 2.3 Use the Silicon Wafer Ctrl 2.2 and Vial (Positive Photoresist Developer) in the Chemical Processor to remove the unexposed photoresist and obtain Silicon Wafer Ctrl 2.3.
Chemical Processor
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- Step 2.4 Use the Silicon Wafer Ctrl 2.3 and Vial (Ammonium Fluoride Etchant) in the Chemical Processor to etch the 2nd wells and obtain Silicon Wafer Ctrl 2.4.
Chemical Processor
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- Step 2.5 Use the Silicon Wafer Ctrl 2.4 and Vial (Photoresist Stripper SPM) in the Chemical Processor to remove the exposed photoresist and obtain Silicon Wafer Ctrl 2.5.
Chemical Processor
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- Step 2.6 Use the Silicon Wafer Ctrl 2.5 in the Wafer Washer to clean the wafer of photoresist residues and obtain Silicon Wafer Ctrl 2.6.
Wafer Washer
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- Step 2.7 Use the Silicon Wafer Ctrl 2.6, a bag of phosphorus and Mask (Ctrl 2nd well) in the Ion Bean to seed the 2nd well with ions and obtain Silicon Wafer Ctrl 2.7.
Ion Implanter
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- Step 2.8 Use the Silicon Wafer Ctrl 2.7 and an Oxygen Cartridge in the O2 furnace to grow a SiO2 layer in the wafer and obtain Silicon Wafer Ctrl 2.8.
O2 Furnace
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- Step 2.9 Use the Silicon Wafer Ctrl 2.8 in the scanning electron microscope to check if the 2st well was correctly created and obtain Silicon Wafer Ctrl 2.9.
Scanning Electron Microscope
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- Step 3.0 Get the Mask (Ctrl Metal) from the Mask Writer.
Mask Writer
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- Step 3.1 Use the Silicon Wafer Ctrl 2.8, Mask (Ctrl Metal) and a Vial (Positive Photoresist) in the Chemical Solution Deposition machine to obtain the Silicon Wafer Ctrl 3.1.
Chemical Solution Deposition
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- Step 3.2 Use the Silicon Wafer Ctrl 3.1, Mask (Ctrl Metal), Vial (Positive Photoresist) and a UV bulb in the Contact Printer to imprint the etching pattern and obtain the Silicon Wafer Ctrl 3.2. For positive photoresist, the contact printer light will harden and unexposed positive photoresist is soft and easily removable. The opposite occurs in negative photoresist.
Contact Printer
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- Step 3.3 Use the Silicon Wafer Ctrl 3.2 and Vial (Positive Photoresist Developer) in the Chemical Processor to remove the unexposed photoresist and obtain Silicon Wafer Ctrl 3.3.
Chemical Processor
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- Step 3.4 Use the Silicon Wafer Ctrl 3.3 and Vial (Ammonium Fluoride Etchant) in the Chemical Processor to etch the metal contacts and obtain Silicon Wafer Ctrl 3.4.
Chemical Processor
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- Step 3.5 Use the Silicon Wafer Ctrl 3.4 and Vial (Photoresist Stripper SPM) in the Chemical Processor to remove the exposed photoresist and obtain Silicon Wafer Ctrl 3.5.
Chemical Processor
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- Step 3.6 Use the Silicon Wafer Ctrl 3.5 in the wafer washer to clean the wafer of photoresist residues and obtain Silicon Wafer Ctrl 3.6.
Wafer Washer
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- Step 3.7 Use the Silicon Wafer Ctrl 3.6 and a copper nugget for Atomic Layer Deposition to create a copper layer in the wafer and obtain Silicon Wafer Ctrl 3.7.
Atomic Layer Deposition
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- Step 3.8 Use the Silicon Wafer Ctrl 3.7 in the chemical mechanical polisher to strip the excess of metal and obtain a Unwashed Controller Die Wafer.
Chemical Mechanical Polisher
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- Step 3.9 Use the Unwashed Controller Die Wafer in the Wafer Washer to clean the wafer of photoresist residues and obtain the Unchecked Controller Die Wafer.
Wafer Washer
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- Step 3.10 Use the Unchecked Controller Die Wafer in the scanning electron microscope to check if there are any defects in the Controller Die Wafer.
Scanning Electron Microscope
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- Step 3.11 Use the Controller Die Wafer in the Stone Cutter to obtain the Controller Die.
Stonecutter
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- Create the controller chip - Use a Controller Die, the Enclosure and the Interconnection Array in the Crafting Table to obtain the controller chip.
Crafting Table
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History
Semiconductor module 1.0
Gallery
Links to learn more
Semiconductor fabrication 101 online course from Purdue University (MOC)
Semiconductor manufacturing from Duane Boning at MIT (Course materials)
Certification
Semiconductor fabrication 101 online course from Purdue University (MOC)
References
Semiconductor fabrication 101 online course from Purdue University (MOC)
The Amazing, Humble Silicon Wafer Video from Asianometry (Youtube video)