Silicon Wafer (N-type) SiO2

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Description

The silicon wafer (N-type) SiO2 can be made from the silicon safer (N-type) using the O2 furnace. It is the first step into the production of the [[Controller chip|controller chip].

N-type silicon occurs when group V elements like phosphorus, arsenic, or antimony are used to dope the silicon. This gives the silicon an abundance of negative charge carriers called “electrons”. Hence the “N” for “negative” [1].

The SiO2 layer, also called dieletric layer, is isolating, functioning as a barrier for electrons [2].


Properties

Name Value
Release Version 1.3.2

Recipes

O2 Furnace

Outputs Components Recipe
Fuel
Cartridge (Oxygen)
1
Silicon Wafer (N-type)
Silicon Wafer (N-type) SiO2

Contact Printer

Outputs Components Recipe
365 nm UV Bulbs
Mask (Ctrl 1st well)
Vial (Positive Photoresist)
Silicon Wafer (N-type) SiO2
Silicon Wafer Ctrl 1
Fuel

History

Gallery

References