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− | The '''silicon wafer (N-type) SiO<sub>2</sub>''' can be made from s [[Silicon Wafer (N-type)|silicon safer (N-type)]] using the [[O2 Furnace|O<sub>2</sub> furnace]]. The SiO<sub>2</sub> layer, also called dieletric layer, is isolating, functioning as a barrier for electrons [https://en.wikipedia.org/wiki/Dielectric]. | + | The '''silicon wafer (N-type) SiO<sub>2</sub>''' can be made from s [[Silicon Wafer (N-type)|silicon safer (N-type)]] using the [[O2 Furnace|O<sub>2</sub> furnace]]. N-type silicon occurs when group V elements like phosphorus, arsenic, or antimony are used to dope the silicon. This gives the silicon an abundance of negative charge carriers called “electrons”. Hence the “N” for “negative” [https://waferpro.com/what-are-p-type-and-n-type-silicon-wafers/]. The SiO<sub>2</sub> layer, also called dieletric layer, is isolating, functioning as a barrier for electrons [https://en.wikipedia.org/wiki/Dielectric]. |
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Revision as of 21:55, 18 April 2024
Description
The silicon wafer (N-type) SiO2 can be made from s silicon safer (N-type) using the O2 furnace. N-type silicon occurs when group V elements like phosphorus, arsenic, or antimony are used to dope the silicon. This gives the silicon an abundance of negative charge carriers called “electrons”. Hence the “N” for “negative” [1]. The SiO2 layer, also called dieletric layer, is isolating, functioning as a barrier for electrons [2].
Properties
Name
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Value
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Release Version
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1.3.2
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Recipes
O2 Furnace
Outputs
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Components
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Recipe
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1
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Contact Printer
Outputs
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Components
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Recipe
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History
Gallery
References