Difference between revisions of "Enclosure"
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* [[Mold (Die Enclosure)|Mold (Die Enclosure)]] | * [[Mold (Die Enclosure)|Mold (Die Enclosure)]] | ||
| {{Inventory| | | {{Inventory| | ||
− | {{Inventory/Slot|index=0|title=Bag (Liquid Crystal Polymer Pellets)|image= | + | {{Inventory/Slot|index=0|title=Bag (Liquid Crystal Polymer Pellets)|image=Vessel_bag.png|link=Bag (Liquid Crystal Polymer Pellets)}} |
{{Inventory/Slot|index=1|title=Mold (Die Enclosure)|image=Mold.png|link=Mold (Die Enclosure)}} | {{Inventory/Slot|index=1|title=Mold (Die Enclosure)|image=Mold.png|link=Mold (Die Enclosure)}} | ||
{{Inventory/Slot|index=8|title=enclosure|image=Enclosure.png|link=enclosure}} | {{Inventory/Slot|index=8|title=enclosure|image=Enclosure.png|link=enclosure}} |
Revision as of 22:44, 20 March 2024
Description
Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
To produce the enclosure, a enclosure mold is needed.
A enclosure is used as a component in several devices including controllers, SSDs and CPUs.
Recipes
Machining Mill
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Injection Molder
Outputs | Components | Recipe |
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History
Semiconductor module 1.0