Difference between revisions of "Enclosure"
Jump to navigation
Jump to search
| Line 9: | Line 9: | ||
===Machining Mill=== | ===Machining Mill=== | ||
| − | |||
{| class="wikitable sortable collapsible" | {| class="wikitable sortable collapsible" | ||
|- | |- | ||
| Line 22: | Line 21: | ||
| | | | ||
* [[Image:Mold.png|link=Metal Die (Cord)|32px|alt=Metal Die (Cord)|[[Metal Die (Cord)|Metal Die (Cord)]]]] [[Metal Die (Cord)|Metal Die (Cord)]] | * [[Image:Mold.png|link=Metal Die (Cord)|32px|alt=Metal Die (Cord)|[[Metal Die (Cord)|Metal Die (Cord)]]]] [[Metal Die (Cord)|Metal Die (Cord)]] | ||
| − | + | |} | |
| − | + | ===Machining Mill=== | |
Revision as of 22:13, 20 March 2024
Description
Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
To produce the enclosure, a enclosure mold is needed.
A enclosure is used as a component in several devices including controllers, SSDs and CPUs.
Recipes
Machining Mill
| Components | Recipe | Outputs |
|---|---|---|
   |
Machining Mill
| Outputs | Components | Recipe |
|---|---|---|
    |
History
Semiconductor module 1.0
Gallery
