Difference between revisions of "Enclosure"
Jump to navigation
Jump to search
Line 4: | Line 4: | ||
To produce the [[enclosure]], a enclosure mold is needed. | To produce the [[enclosure]], a enclosure mold is needed. | ||
− | A [[ | + | A [[enclosure]] is used as a component in several devices including [[controller]]s, [[SSD]]s and [[CPU]]s. |
==Recipes== | ==Recipes== |
Revision as of 22:07, 20 March 2024
Description
Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
To produce the enclosure, a enclosure mold is needed.
A enclosure is used as a component in several devices including controllers, SSDs and CPUs.
Recipes
Crafting Table
Outputs | Components | Recipe |
---|---|---|
History
Semiconductor module 1.0