Difference between revisions of "Enclosure"
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==Description== | ==Description== | ||
− | [[enclosure | Semiconductor enclosure]] is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure | + | [[enclosure | Semiconductor enclosure]] is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. |
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+ | To produce the [[enclosure]], a enclosure mold is needed. | ||
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+ | A [[enclosure | Semiconductor enclosure]] is used as a component in several devices including [[controller]]s, [[SSD]]s and [[CPU]]s. | ||
==Recipes== | ==Recipes== |
Revision as of 22:06, 20 March 2024
Description
Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
To produce the enclosure, a enclosure mold is needed.
A Semiconductor enclosure is used as a component in several devices including controllers, SSDs and CPUs.
Recipes
Crafting Table
Outputs | Components | Recipe |
---|---|---|
History
Semiconductor module 1.0