Difference between revisions of "Enclosure"

Revision as of 22:04, 20 March 2024

Description

The idea behind the microcontroller unit is that it is cost-effective, energy-efficient processor that can be purpose-built for a specific application. But some of these devices also have become much more capable over the past few years, blurring the definition of exactly what is a microcontroller. An controller chip is used as a component in several devices including Metal Detectors, wearables, SSDs and CPUs.

Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. An Semiconductor enclosure is used as a component in several devices including controllers, SSDs and CPUs.

Recipes

Crafting Table

Outputs	Components	Recipe
Controller Chip	Enclosure Controller Die Interconnection Array

History

Semiconductor module 1.0

Gallery

References

Integrated Circuit Packaging

Semiconductor Package

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-is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
+[[enclosure | Semiconductor enclosure]] is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
+An [[enclosure | Semiconductor enclosure]] is used as a component in several devices including [[controller]]s, [[SSD]]s and [[CPU]]s.
 ==Recipes==