Difference between revisions of "Enclosure"
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* [[Sack (Acrylonitrile-Butadiene-Styrene Pellets)|Sack (Acrylonitrile-Butadiene-Styrene Pellets)]] | * [[Sack (Acrylonitrile-Butadiene-Styrene Pellets)|Sack (Acrylonitrile-Butadiene-Styrene Pellets)]] | ||
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− | * [[Image: | + | * [[Image:Enclosure.png|link=ABS Brick (1 x 1)|32px|alt=ABS Brick (1 x 1)|[[ABS Brick (1 x 1)|ABS Brick (1 x 1)]]]] [[ABS Brick (1 x 1)|ABS Brick (1 x 1)]] |
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* [[Sack (Acrylonitrile-Butadiene-Styrene Pellets)|Sack (Acrylonitrile-Butadiene-Styrene Pellets)]] | * [[Sack (Acrylonitrile-Butadiene-Styrene Pellets)|Sack (Acrylonitrile-Butadiene-Styrene Pellets)]] |
Revision as of 22:36, 20 March 2024
Description
Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.
To produce the enclosure, a enclosure mold is needed.
A enclosure is used as a component in several devices including controllers, SSDs and CPUs.
Recipes
Machining Mill
Components | Recipe | Outputs |
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Injection Molder
Outputs | Components | Recipe |
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History
Semiconductor module 1.0