Enclosure

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Description

Semiconductor enclosure is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. I confers protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader.

To produce the enclosure, a enclosure mold is needed.

A enclosure is used as a component in several devices including controller chips, SSDs and CPUs.

Recipes

Machining Mill

Components Recipe Outputs
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Titanium Ingot
Mold (Die Enclosure)
Water Bucket

Injection Molder

Outputs Components Recipe
Bag (Liquid Crystal Polymer Pellets)
Mold (Die Enclosure)
enclosure
Water Bucket
Fuel

Bag (PolyHexamethylene Adipamide Pellets)
Mold (Die Enclosure)
enclosure
Water Bucket
Fuel

Bag (PolyHexamethylene Sebacamide Pellets)
Mold (Die Enclosure)
enclosure
Water Bucket
Fuel

Crafting Table

Outputs Components Recipe
Enclosure
Controller Die
Interconnection Array
Controller Chip

History

Semiconductor module 1.0

Gallery

Enclosure.png

References

Integrated Circuit Packaging

Semiconductor Package