Description
The silicon wafer (N-type) SiO2 can be made from the silicon safer (N-type) using the O2 furnace. It is the first step into the production of the [[Controller Chip|controller chip].
N-type silicon occurs when group V elements like phosphorus, arsenic, or antimony are used to dope the silicon. This gives the silicon an abundance of negative charge carriers called “electrons”. Hence the “N” for “negative” [1].
The SiO2 layer, also called dieletric layer, is isolating, functioning as a barrier for electrons [2].
Properties
Name
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Value
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Release Version
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1.3.2
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Recipes
O2 Furnace
Outputs
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Components
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Recipe
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1
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Contact Printer
Outputs
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Components
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Recipe
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History
Gallery
References